News
STILE is a substrate-embedded, passive module designed by Saras Micro Devices to support the growing number of power rails in ...
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced a new high-performance ...
or system-in-package (PSiP). Improvement in total inductance and Q factor is demonstrated for the multiturn bondwire inductors due to the coupling effect. An empirical calculation method is developed ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results