By upgrading to the 3-nm process, Marvell is positioning the new Ara DSP to be a key building block of 1.6-Tb/s optical ...

Allegro's ACS37030 50-A current sensor protects wide-bandgap GaN devices by sensing current over the industry’s widest frequency range for automotive, industrial, and ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

A new n-channel MOSFET in a slim 8x8 mm package sets a benchmark with just 0.88 mΩ RDS(on), 0.36 °C/W thermal resistance, and ...

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced a new high-performance ...

Disruptive Chipset Platform Redefines Satellite Agility, Efficiency, and Sustainability; Enables More than 60% Reductions in Size, Weight, and Cost of Flat Panel Antennas ...

Similar to its existing RZ/A3UL, the new MPU features a 64-bit Arm Cortex-A55 core with a maximum operating frequency of 1GHz and 128KB of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

Since publishing this video, it has come to our attention that the Predator Orion X prebuilt system, from which we took this RTX 4090, was a late-stage engineering sample and not a finished retail ...

Toshiba has released four 650-V third-generation SiC MOSFETs in compact 8×8-mm DFN packages. The surface-mount DFN reduces ...

Corsair's impressive new Multi Frame Pegboard has rooms for multiple shelves, pegboards, and rails to keep your gaming PC ...