Taiwanese electronics giant Foxconn is among potential bidders for UTAC Holdings, a Singapore-based semiconductor assembly ...

Taiwan's Foxconn is among potential bidders for the Singaporean semiconductor assembly and testing business UTAC Holdings in ...

Fig. 1: Multiple die entering the assembly process flow, exiting as a chiplet-based system. Source: A. Meixner/Semiconductor Engineering Addressing these inconsistencies requires new materials and new ...

Although semiconductor assembly requires lower precision than ... chips are still assembled with wire bonding techniques, this process and the back-end machines used for it are more commoditized ...

Last week, India cleared a proposal for a new chip plant to be developed by HCL Group and Taiwanese electronics giant Foxconn ...

Anthony Paul Bellezza the inventor of a 2D Graphene fusion process being used for CMOS Chip assembly processes, that fuses interconnects at temperatures within the thermal budget of the chip below ...

The proposed facility would aim to produce more than 100 million System-in-Package (SiP) units annually by 2031, targeting ...

has been a key player in Malaysia's semiconductor landscape for more than 50 years. Ambitious to lead in assembly and packaging, NXP focuses on innovation, process improvements and workforce ...