Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance – enabling a new and compelling solution for 3D IC and chiplet offerings to a breadth of semiconductor market verticals.

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

The last time a U.S.-bound Subaru wore the STI badge was in 2021. Yet, that hasn’t stopped Subaru from releasing all manner of WRX trims and “engineering exercises” that get close but never ...

The Subaru WRX STI S210 is the latest in the model’s S-series of special edition cars. The Subaru WRX STI S210 will be capped at 500 examples globally, with regional allocation still to be ...

In March 2022, there was a startling announcement: Subaru would not produce a next-generation gas-powered WRX STI. Nearly three years later, the company appears to have had a change of heart.

The Subaru WRX STI S210 prototype has been revealed, which previews a new production version. The new STI doesn't offer a manual, and its engine is expected to make 296 horsepower and 277 pound ...

Fitting, then, considering what WRX stands for on Subaru. Fast forward to 1994 and the WRX STI was introduced, which was developed by Subaru Tecnica International (STI), the same team that runs ...

Multiphysics analysis for reliability As TSMC advances 3D-IC packaging technologies, thermal and stress multiphysics analysis has become essential for ensuring the reliability of advanced multi ...

2.5D layouts connect multiple die on an interposer; 3D IC designs stack multiple layers of chiplets, potentially from different process nodes, into a single, cohesive package (Figure 1).

The company rolled out Calibre 3D Thermal to help deliver fast and accurate die-level thermal analysis of 3D IC designs. Today, most of the big names in the semiconductor industry are racing into ...