The company–Substrate Technologies Inc. (STI)–has begun producing what it calls “built-up” BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company is also ...

A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...