Abstract: A novel concept of silicon-based packaging platform with microreflector and embedded electrode-guided interconnections was development for a package component of a light-emitting diode (LED) ...

These operations are done in a way that is transparent to the system utilizing the IP, abstracting all the parallelization complexity from the rest SoC components. The number of internal compression ...

The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices. This gives PDA and smartphone ...

The assurance of board-level drop test reliability for surface-mounted components is mandated by JEDEC standards [5]. Within this framework, package reliability is evaluated experimentally using a ...

He’s the type of player that could absolutely shine in the right preseason matchup or end up as just a field-stretching package component, but there’s no doubt he possesses one of the most exciting ...

This provides unique challenges for a Roku package manager, because file paths alone are not enough to prevent symbol collisions. ropm solves the naming collision problem by rewriting the names of all ...