The mmWave block upconverter upconverts standard 2- to 18-GHz bands into mmWave signals (18 to 40 GHz) in a 30-mm 2 BGA ...

ASE has transitioned to AMD EPYC and Ryzen processors across its data centers and client systems, achieved major performance ...

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. , today announced Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon Via (TSV), ...

ASE's powerSiP technology redesigns power delivery ... It also places the voltage regulation inside the package or very close to it, instead of relying on distant motherboard components, helping ...

ASE’s new configuration enables crucial on-package energy efficiency and bandwidth ... To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies ...

and system-in-package (SiP). The end markets for ASE's packaging solutions include consumer electronics, automotive, and high-performance computing. For the third quarter of 2024, ASX’s revenue ...

Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to ... To learn about our ...

Joseph Tung: As I mentioned, we don’t particularly comment on different packages’ profit ... a similar growth with ASE this year. I’m not sure how to answer the SiP part of the question ...

System in Package (SiP) Technology Market Growth ... Powertech Technologies, and ASE Group. Amkor Technology, a pioneer in SiP technology, offers a wide range of advanced packaging solutions ...