The architectural planning and analysis workflow enables system and RTL designers to rapidly explore and capture viable ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

MIT chemists have now come up with a new way to determine those 3D genome structures, using generative artificial intelligence. Their technique can predict thousands of structures in just minutes ...

With the produced demonstrators of the storage compartment cover, the implementation of the thermoplastic sandwich moulding technology could be proven for the first time on a real component structure.

CSIP is implemented via a management platform known as OAIS (Open Archival Information Package). That comprises tools to convert source data using SIP (Submission Information Package), to preserve ...

The advantages of 3D digital twins when it comes to building ... blocks that can be mixed and matched in a system in package (SiP). These chiplets are then bolted together with 2.5D or 3D packagin ...

SiP technology allows for the integration of RF, analog, digital, and memory functions into a single package using advanced ... and so on.” 3D-ICs will present other testing difficulties. The ...