Primit Parikh, VP of the GaN Business Division at Renesas, talks about current and future developments using GaN.

Advancements in semiconductor fabrication technologies and chip packaging processes have been central to the explosive growth of these electronic devices. However, in today's age of artificial ...

A new technical paper titled “Gate dielectrics for transistors based on two-dimensional transition metal dichalcogenide ...

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different ...

Boeing’s engine fuel control switches, now the center of the investigation into the fatal Air India crash in June, have been scrutinized before.

This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits ...

The 2D FIR Filter IP core performs real-time 2D convolution of windowed portions of incoming video frames with coefficient matrices held in internal memory. Its flexible architecture supports a wide ...

Build your own (nearly) all-inclusive Hawaii vacation with the special packages offered by these family resorts.

The molded underfill (MK) process for system-in-package (SiP) assembly has been widely used for recent years. In the past, the main structure of the MK was molded flip chip chip scale package (MFCCSP) ...

This paper presents a 3D SIP (system in package) design of four-channel power detection and signal amplification. It used HDI (High-Density Interconnect) technol ...