With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is ...

Nexperia announced the addition of two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding ...

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

Key Takeaways The integrated circuit package started with simple designs like the Dual In-Line Package, then moved to surface mount tech, and now uses area array packages for more connections. The ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

The System in Package (SiP) Technology market is estimated to expand at an unexpected CAGR from 2024 to 2032, reaching multimillion USD by 2032 compared to 2022.

Analog IP in a Package For Analog Devices—one of the semiconductor vendors supporting Virtuoso Studio out of the gate—co-design of the IC and packaging is key for 2.5D and 3D system-level product ...

The QFP is composed of plastic components, rendering it lightweight and economical. The QFP offers several benefits, including compact size, a high pin count, and excellent thermal performance. Yet, ...