Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million gates needs a way to get all that data in and out! Early on, packages just ...

With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is ...

Primit Parikh, VP of the GaN Business Division at Renesas, talks about current and future developments using GaN.

EDA and silicon IP revenue grew 12.8% in Q1 2025, totaling $5.098 billion compared to $4.522 billion in the same period last ...

Seeed Studio Wio-LR1121 is a tiny, multi-band LoRa module based on LR1121 RF transceiver, a low-cost version of LR1120 ...

Integrated phononic waveguide on thin-film lithium niobate on diamond; aZnMIm resist for EUV lithography; TMDC multi-channel GAA-FET architectures at sub-1nm; HW trojans detection using GNNs; agentic ...

Ultra-miniature RF modules specialist Insight SIP has launched the ISP2554-HM module, a dynamic IOT node, with support for ...

Summer’s here—and so are the long days, warm nights, and endless reasons to celebrate. Whether you're shopping for beach lovers, backyard grill masters, or globe-trotting adventurers, our curated ...