The earlier the SiP-design experts engage with the system designers, the better the resulting design quality is likely to be.

The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...

The idea is to pave the way for automating System-in-Package (SiP) design and build using such chiplets. As mentioned, the four kits are the result of an alliance between the JEDEC Solid State ...

The EDA market segment and its product portfolio have a huge impact on the semiconductor industry. Without automation tools for chip/system design and verification, there ...

Winer said that SIP has been developing the project in stealth mode for almost two years already, and that it was an offshoot of other research that it had been doing into electricity grid ...