The earlier the SiP-design experts engage with the system designers, the better the resulting design quality is likely to be.

By performing early chip, package and system thermal analysis, designers can systematically predict the power profile of the chip for various scenarios and its impact on power-thermal reliability.

with power, thermal, and noise-aware optimization MOUNTAIN VIEW, Calif., April 28, 2020-- Synopsys, Inc. (Nasdaq: SNPS) today introduced its 3DIC Compiler platform to transform the design and ...

This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.

ASE's powerSiP technology redesigns power delivery with a vertically integrated, multi-stage VRM that reduces power losses ...