A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design ...

At a recent packaging conference, Amazon's and Microsoft's progress in transitioning to sustainable packaging at scale was ...

Once seen as a threat to the planet, plastic is getting a second life, thanks to Yuvraj Singh Ahuja’s award-winning design ...

Creating packaging designs and innovations that aim to reduce and ultimately eradicate single-use plastics within the industry, it is already leading the way in alternatives including board trays for ...

ATLANTA (November 12, 2024) — *Earlier this year, the Arthritis Foundation announced its partnership with Target to develop Ease of Use ® Design Guides for product and packaging engineers and ...

The proposed design increases flexibility in the design stage and enables an efficient debugging process, which is essential for scaling up channels in a DAQ system. New packets can be defined without ...

A few examples include updating the Unified Power Format (UPF) spec as modules change, interfaces shift, and the design grows. But even with synchronized RTL and UPF efforts, verification remains a ...

My focus is on packaging design, materials, and waste strategy. I help corporates determine whether to switch materials or rethink their business models, like reuse or take-back schemes. Since we’re a ...

When it comes to products and packaging, each design decision has the power to include or exclude possible customers. For nearly 60 million adults living with arthritis and many more with chronic pain ...

Konstanz, Germany, February 12, 2003 - Hyperstone introduced today its RISC/DSP microprocessors in TFBGA packaging (E1-16XSBâ„¢, E1-32XSBâ ... integration in customers’ proprietary SoC designs.

Abstract: An in-package antenna is proposed for a wireless ingestible capsule ... A modified planar inverted-F structure is implemented for the antenna design, in order to follow the shape of the ...

Three-dimensional (3D) heterogeneous integration enables semiconductor designers and manufacturers to combine multiple technologies, processes and functionalities in a single package. Not only does ...