However, it also brings new challenges in the thermal design aspect and thermal crosstalk between chiplets. In this article, the thermal modeling of a chiplet-based packaging with a 2.5-D interposer ...

(1) We released the 50 diffusion steps model (instead of 1000 steps) which runs 20X faster with comparable results. (2) Calling CLIP just once and caching the result runs 2X faster for all models.