Thermal integrity is known to be one of the most challenging barriers in the development of 2.5-D/3-D integrated packaging systems. In this work, an embedded microchannel heatsink (EMCHS) with through ...

The procedure for creation of the SPICE compatible spatial equivalent circuit model of the heatsink is presented in this paper. The model is based on the electro-thermal analogy and finite volume ...

Apple typically saves its premium features for the Pro models of its iPhone lineup. Will an iPhone 17 vs. iPhone 17 Pro comparison reveal those kinds of differences this fall?