News

You may think that potato chips are the same everywhere, but there are plenty of regional styles to try. Here are some of the ...
TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...
As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...
TAIPEI -- Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach to chip packaging to meet demand for more powerful AI chips, with plans to ...
Earlier today, the tech giant introduced Majorana 1, the world’s first quantum computing chip, a breakthrough that has set the whole tech world abuzz. The company spent years building the chip ...
TL;DR: TSMC is developing an advanced chip packaging plant in the US, influenced by President Trump's proposed tariffs on Taiwanese semiconductors. Trump aims to return chip production to the US ...
Huang explained the transition in Nvidia's chip packaging requirements. "As we move into Blackwell, we will use largely CoWoS-L. Of course, we're still manufacturing Hopper, and Hopper will use ...
GlobalFoundries now plans to build a first-of-its-kind advanced chip Packaging and Photonics Center right here in the Capital Region. I’m proud to deliver this additional $75 million ...
GlobalFoundries is now planning to build a $575 million chip packaging and testing center at the site as well. GlobalFoundries CEO Thomas Caulfield, left, and Gov. Kathy Hochul, right, stop for a ...
Forward-looking: The Department of Commerce has announced $1.4 billion in awards through the CHIPS National Advanced Packaging Manufacturing Program. While this initiative will contribute to ...
Chip packaging technology is one of the main keys, and TSMC also dominates in that section. That said, Qualcomm could shake the foundations of the industry by depending less on TSMC’s advanced ...