Lam Research Corp. today announced what the company says it the industry's first etch platform series capable of handling both 200- and 300-mm wafers as well as a wide range of process applications in ...

Lam's new systems address this need for three of the most critical steps in forming 3D NAND memory cells: stack deposition (VECTOR® Q Strata™), vertical channel etching (2300® Flex™ F Series ...

Lam Research Corp. today debuted an etch product line for 200mm and 300mm wafers ableto support all etch applications for sub-130nm technology nodes. The 2300 Etch Series consists of the Exelan ...