The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws.

Intel made its claims at the 2025 Symposium on VLSI Technology in Japan, according to PC Gamer. The chipmaker compared its 18A node with the Intel 3 node, which didn’t lead to chips in laptops.

As the materials that the wafer dicing process need to singulate become more complex a diverging current Process of Record (PoR) dicing technologies are not able to meet the quality and or cost ...

Stealth dicing (SD) is a low-cost and precise semiconductor assembly process that induces subsurface damage with infrared light to separate wafer into individual dies. Pre-thinning is a critical step ...