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Infineon Technologies AG announced the first of a new family of radiation-hardened Gallium Nitride (GaN) transistors, ...
Infineon has announced the first of a new family of radiation hardened GaN HEMTs, fabricated at Infineon’s own foundry, based ...
Gallium nitride (GaN) transistors have radiation tolerance that makes them a good fit for a growing variety of space industry ...
3d
Tom's Hardware on MSNIntel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidthIntel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...
Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...
Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...
Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247. A single high-current IGBT in a DTO247 can replace multiple lower-current TO247 IGBTs ...
which CDIL will process and package into power chipsets. This partnership is seen as a potential precursor to Infineon expanding its OSAT footprint in the country. “Their (Infineon’s ...
NEW DELHI: Continental Device India Limited (CDIL) Semiconductors and Infineon Technologies Asia Pacific, a power systems and Internet of Things (IoT) manufacturer, have partnered to package ...
Germany’s Infineon Technologies wants a crack at India, and on Thursday it signed a deal to do just that. A new partnership with CDIL Semiconductors will see the pair working together to build ...
Infineon's SECORA Pay Green enables fully recyclable, eco-friendly payment cards, reducing CO₂ emissions. Recognized by Mastercard’s Greener Payments Partnership (GPP), it helps cut plastic use. By ...
Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...
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