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Infineon’s 650-V G5 bidirectional switch integrates two switches in a single device to actively block current and voltage in ...
To support the evolution of next-generation solid-state power distribution systems, Infineon Technologies AG is enhancing ... Optimized with a bulk-channel SiC structure, the devices demonstrate high ...
Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...
Infineon is shoving a cattle prod into the outdated power architecture of AI data centres with a high-voltage jolt. Teaming up with Nvidia, the chipmaker is ditching the feeble, cluttered PSU ...
Infineon Technologies and Nvidia announced a collaboration to develop 800-volt DC power architectures for artificial intelligence (AI) data centers, as the industry confronts exponential growth in ...
FRANKFURT (Reuters) -German chipmaker Infineon Technologies reported stable order intake on Thursday but lowered its full-year revenue outlook due to uncertainty over global tariff disputes.
Compound Semiconductorâ„¢ is an Angel Business Communications publication.
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
(Reuters) - German chipmaker Infineon Technologies said on Monday it would buy Marvell Technology's automotive ethernet business for about $2.5 billion in cash, to expand its microcontroller segment.
The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO ... effect account for less than 5% of the entire channel. However, in the package industry, IC functions ...
On Tuesday, May 20, Infineon Technologies (OTC:IFNNY) announced a collaboration with NVIDIA Corporation (NASDAQ:NVDA) to revolutionize the power delivery architecture for future AI data centers.
Interposers are intermediate substrates and an important part of chipsets. AI semiconductors have a 2.5D package structure with a graphics processing unit (GPU) in the middle and high bandwidth memory ...