Attempts to boost power density become a juggling act to get the most functionality into the least space while managing thermal issues, reliability, and EMI.

The PCB design software market is expected to expand at a high growth rate from 2025 to 2035 with the development of high-end ...

OKI Circuit Technology ("OTC"; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit ...

Hommer Zhao, Owner of OurPCB, shared insights on the development of aluminium PCBs: "As electronic devices become more powerful, managing heat dissipation has become increasingly important. Aluminium ...

EDA software is revolutionizing high-speed digital design by accelerating time-to-market despite growing complexity.

Known as co-packaged copper (CPC), or co-packaged cables in some circles, the basic idea is to take a copper cable straight ...

OKI Circuit Technology (“OTC”; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit board (PCB ... high-speed, high-frequency, and high-density ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB ...