Glass substrates will replace traditional organic ... focus for ultra-dense interconnects in advanced system-in-packages, whereas superior thermal and mechanical stability makes them more reliable ...

Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

This is because glass substrates for now only seem to be really beneficial for big, multi-chip packages. While AMD's all for chiplet designs in its gaming processors, it will probably make more ...

The use of glass interposers instead of silicon could help Samsung cut production costs while offering more powerful AI chips ...

German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate ...

Onto Innovation ONTO recently unveiled its glass substrate suite encompassing the ... supporting heterogeneous integration chiplet packages for AI, high-performance compute and cloud computing.

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography ...