German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate ...

CircupositTM SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

Northwestern University researchers have developed a new water- and oil-resistant material that could become a safe, viable ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

It will directly impact where the brains of our AI devices are built. Samsung, a giant in the semiconductor industry, is ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

We think Corning can produce these high-quality glass substrates at a lower cost than ... We also sell both admissions and sponsorship packages for our investment conferences and advertising ...

TASMIT aims to supply the large glass substrate inspection system to manufacturers of advanced ... has led to larger semiconductor chips and a higher number of chips per package due to greater ...

TASMIT Inc. has released a new inspection system for glass substrates as part of its INSPECTRA series ... has led to larger semiconductor chips and a higher number of chips per package due to greater ...