Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of ...

CircupositTM SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

Fiber lasers aren’t nearly as common as their diode and CO2 cousins, but if you’re lucky enough to have one in your garage or ...

Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

It will directly impact where the brains of our AI devices are built. Samsung, a giant in the semiconductor industry, is ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Abstract: Some package substrates are composed of glass fiber bundles and epoxy resin which have different electrical properties. These differences result in variations in characteristic impedance and ...

In order to enable the further uptake of flip-chip technology, new materials and methods for substrate manufacture are required. Glass as a substrate material offers a number of potential advantages ...