Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of ...

CircupositTM SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

Fiber lasers aren’t nearly as common as their diode and CO2 cousins, but if you’re lucky enough to have one in your garage or ...

Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Abstract: In this paper, we fabricated optical textured glass substrates by a polydimethylsiloxane (PDMS) nanoimprint lithography (NIL) on the front glass to enhance conversion efficiency of ...