Glass substrates will replace traditional organic ... focus for ultra-dense interconnects in advanced system-in-packages, ...

are another integral component of advanced chip packages. Unlike main glass core substrates, these will continue to use organic dielectric materials and copper; only this time, they will be ...

Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

The use of glass interposers instead of silicon could help Samsung cut production costs while offering more powerful AI chips ...

This is because glass substrates for now only seem to be really beneficial for big, multi-chip packages. While AMD's all for chiplet designs in its gaming processors, it will probably make more ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography ...

Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition The AICS HI roadmap is rapidly approaching several ...