This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

For the EU funded project, they teamed up with high-profile partners from research and industry under IMEC’s coordination to give data networks a speed boost with a novel type of optical circuits.

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging ...

According to the SNS Insider Report, “The Interposer and Fan-out Wafer Level Packaging Market was valued at USD 32.38 billion in 2023 and is projected to reach USD 88.77 billion by 2032, growing ...

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ... DELO has developed a ...

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...

The traditional wafer level packages (WLPs) are fan-in redistribution layer (RDL) lay-out design; it may not be able to meet the high pin-count handheld device requirement. So the new fan-out wafer ...

ASE has developed a 70×78-mm Fan-Out Chip on Substrate Bridge (FOCoS-Bridge) package that packs two ASICs and eight high-bandwidth memory devices connected via eight silicon bridges. ASE has developed ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources.