This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

Emerging applications such as machine learning (ML) and artificial intelligence (AI) require more computing capabilities that ought to be distributed and have access to large memory and storage, while ...

Next-generation optical inspection is about more than just sensitivity. It’s about reliably seeing through complexity.

As the industry moves Beyond Moore, there has been much efforts for the next-generation of packaging, among which Fan-out wafer-level-package is getting significant attention with its high-degree ...