For the first time in recent memory, the state’s Department of Finance and Administration will hold a hearing to decide the fate of an industrial revenue bond package promised to CN Wire ...

As such, SiP incorporates flip chip (FC), wire bond (WB), and fan-out wafer- level packaging ... integration of various functional blocks such as wire bonding, Package-on- Package (PoP), 2.5D, 3D, ...

corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in miniaturization and multifunction of ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing ... targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array ...

Linear Technology Corporation and Microbonds have announced successful qualification of Microbonds X-Wire insulated wire bonding technology to enable design flexibility for Linear Technology’s ...