Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts processing ...

Heterogeneous integration is an efficiency way to integrate III-V laser diode on the silicon-based photonics integration circuit. To provide the III-V laser diode flip-chip bonding solution with ...

The FirePower series is the industry’s first to combine resonant capacitor charging and high-current laser diode firing on a single chip. This innovation eliminates the need for external discrete ...

The progression of hybrid integration technology for compact electronics and photonics systems is placing increasing demands on the development of novel automated procedures capable of ensuring ...