Introduction The global conformal coatings market is experiencing substantial growth, largely due to the rising incorporation of electronic c ...

Molex unveiled its Genesis connector and cable system at Computex, targeting future PCIe 7.0 deployments with a design ...

These are the most-read stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in ...

"Wi-Fi 7 helps users overcome congestion and interference in large or crowded venues -- like conferences or stadiums -- bringing improved user experiences in areas with densely packed devices or ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Department of Applied Chemistry, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo 112-8551, Japan, Advanced Materials Laboratory, National Institute for Materials ...

Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...

Besides, the high-speed and low-altitude flight process of DAVs brings in the motion blur on the densely packed objects. The average, scale transformation and scene coverage are large, which brings ...

Added monitoring of DC-link voltage for overvoltage and undervoltage helps to enhance battery-pack integrity. Dreamstime_ekkasit919_121661437 Test & Measurement ...

Abstract: Modal properties of single mode lithographic VCSELs are studied for use in densely packed 2-D arrays for improved spectral control, improved beam quality, and high pulse power.