This paper presents a 3D SIP (system in package) design of four-channel power detection and signal amplification. It used HDI (High-Density Interconnect) technol ...

This paper firstly introduces the research progress of ceramic packaging for high temperature electronic devices, then the high temperature performance of the traditional ceramic package was ...

From everyday personal care brands like Dove and L’Oréal to splurge-worthy finds from Dyson, Apple, and Smeg. Read on for our ...