Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

The new IC increases continuous power to more than 1.6 kW and permits brief peak loads of 2.5 kW by leveraging a new, thermally efficient POWeDIP™ package. This package includes an electrically ...

Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=16 ...

SANTEE, Calif., February 25, 2025--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its ...

SANTEE, Calif., February 25, 2025--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its ...

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded ceramic package configurations at two ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible ...

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade packaging that meets the IEC60664-1 isolation standard. Power Integrations ...