Understanding the technology and supporting ecosystem is necessary before chiplets begin to see widespread adoption.

KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol, 2.4GHz antennas ...

Kyocera AVX's chip antenna lineup includes 1001312 linearly polarized ceramic antenna, which comes in a 2.0 x 1.2 x 0.55mm SMT package that weighs 0.003g. Supports 2.0–2.485GHz band in addition to a ...

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological ...

Trying to make AI chips big enough to solve Moore's Law Troubled Chipzilla used the IEEE Electronic Components and Packaging ...

The Ag-alloy stud bumps also exhibit many other advantages for applications in advanced IC and high power flip chip packages as comparing with the conventional Au- or Cu- stud bumps.

From there it can move up, which in a flip-chip package means through the bulk silicon to the backside ... Standard organic substrates conduct heat modestly, but the future may bring ceramic ...

Thus it has reverse engineered Apple PALs, a replacement for the Sony sound chip, an ATtiny based take ... allows for one of the gold-and-ceramic packages to be used. The memory is soldered ...