Integrating multiple chiplets in advanced packaging requires high-bandwidth and energy-efficient chiplet-to-chiplet interconnects. Parallel interconnects have emerged as the preferred interface for ...

A complete optical wireless interface for the ARINC 429 avionics bus has been presented as part of this paper. After evaluating the previous results, we conclude that the described system complies ...

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the RA8P1 microcontroller ...

Trace the evolution of PC graphics buses from IBM’s ISA to the current industry-standard PCIe and uncover how these ...

Bristol-based Truck & Bus Wales & West has invested in an additional set of Stertil-Koni mobile column lifts following a 2024 ...

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the ...

Lux Aeterna on Wednesday emerged from stealth and announced a $4 million pre-seed funding round that will go toward a demonstration mission in 2027 for launching a satellite that will return to Earth ...

From a June 13, 2014 news item on Azonano, Lawrence Livermore National Laboratory recently received $5.6 million from the Department of Defense’s Defense Advanced Research Projects Agency (DARPA) to ...