The Advanced Interface Bus (AIB) is an open-source interconnect standard for creating high-bandwidth/low-power connections between chiplets; ...

Intel’s Advanced Interface Bus is a die-to-die level standard that enables a modular approach to system design with a library of chiplets. The AIB standard interface targets the low-energy, ...

Los Gatos, CA – April 9, 2001 — A new version of the Virtual Component Interface Standard (VCI) has been released by the VSI Alliance from its On-Chip Bus (OCB) Development Working Group (DWG). The ...

News that the federal government may help build a high- occupancy vehicle lane in the congested U.S. 36 corridor has renewed interest in advanced bus rapid transit systems that boast a unique ...

And then you have MDIO, built upon the Advanced Interface Bus (AIB) PHY level interconnect. This die-to-die connection will enable engineers to pick and choose from a library of chiplet blocks, ...

Open development for SOCs gets major boost with new collaboration. SAN FRANCISCO, Jan. 22, 2020 — CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors ...

Ericsson Power Modules has unveiled the BMR458, a third-generation 3E quarter-brick advanced bus converter. The module has been designed for high-power applications that are powered by multi-cell ...

MDIO: Building upon its Advanced Interface Bus (AIB) PHY level interconnect, Intel disclosed a new die-to-die interface called MDIO.

Critical to this effort was the establishment of a common interface standard, which Intel supplied via the Advanced Interface Bus (AIB). AIB is a publicly available, open interface standard that ...

The U.S. Defense Advanced Research Projects Agency has selected Intel for Phase 1 of the Space-Based Adaptive Communications Node program, which aims to create a low-cost, reconfigurable optical ...

Advanced Micro Devices said it is on pace to introduce central processing chips for the data center based on TSMC's 5-nm technology—which is seen as competitive with Intel's 7-nm node—by 2022.