Huawei advances chiplet technology to overcome U.S. semiconductor sanctions Huawei targets innovative chip design to address semiconductor challenges amid U.S. restrictions ...

Xscape Photonics will conduct live demos of the EagleX Laser Evaluation Kit in the Chiplet Pavilion exhibition at DAC 2025 (Booth #2308D), June 22-25, 2025 in San Francisco.

Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry operations ...

Cadence Advances SoC and Chiplet Design With Samsung Foundry June 17, 2025 — 09:45 am EDT Written by Zacks Equity Research for Zacks -> ...

In the RF domain, Cadence and Samsung have demonstrated an advanced co-design flow for Front-End Module (FEM) and Antenna-in-Package (AiP) designs targeting mmWave applications. Built on Samsung ...

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Unfortunately, this chiplet-based ecosystem and industry-standard specification levels are not expected to become reality for several years. Even with standards such as UCIe, there are many options ...

Sessions and demos at EE Times Chiplet Pavilion and booth 2430 SAN JOSE, Calif., June 16, 2025 /PRNewswire/ -- Baya Systems, a leader in high-performance semiconductor system technologies, will ...

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry Business Wire Jun 16, 2025 ...

Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence ® memory and interface IP solutions in ...

Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence ® memory and interface IP solutions in Samsung ...

Industry leaders from Ansys, Intel, Synopsys, and TSMC participated in a panel discussion at Chiplet Summit 2025, sharing their insights and guidance for how to address these evolving challenges.