The development contract includes BOS’ s recently introduced Eagle-N (250 TOPS of automotive AI accelerator) and Eagle-A (stand-alone ADAS SoC) in the chiplet system configuration using a high-speed ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...

A new technical paper titled “Garblet: Multi-party Computation for Protecting Chiplet-based Systems” was published by Worcester Polytechnic Institute. “The introduction of shared computation ...

Power is a concern for every chip and chiplet design, even if the specifics differ based on the application. Systems vendors and leading-edge chipmakers already are using chiplets to improve ...

Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=4 ...