A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic ...
According to Nikkei Asia, wire bonding machines, wafer dicers, and laser drilling machines are all in short supply, with orders for new machines booked out for a year. Like toilet paper this time ...
A new technical paper titled “ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design” was written by researchers at National Taiwan University of ...
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