NXP Semiconductors (Germany) manufacturers a range of high performance mixed signal and standard products used in various applications. Demand for testing at higher temperatures (200°C) on smaller ...

Figure 3. Wafer measurement gage schematic. During the processing of semiconductor wafers, bow and warp are introduced to the wafer profile. Hence, to obtain a true thickness measurement a probe can ...

Power semiconductors such as MOSFETs and IGBTs need measurements and characterization while still on the wafer—for both engineering and production. Thus, you need to probe the wafer. The TESLA200 ...

When it comes to testing VCSEL devices on wafer, however, there are multiple challenges. A major requirement is single and dual-sided testing – probing from the front or backside of the wafer. The ...

Diverse optical wafer defect inspection systems including (a) Brightfield/darkfield imaging system, (b) Dark-field imaging with null ellipsometry, (c) Through-focus scanning imaging microscopy, (d ...

The integration of optical components on a chip creates a host of new challenges and demands for wafer-level probing of SiPh devices. September 8th, 2020 - By: FormFactor As chip designers are pressed ...

NORTH READING, Mass., March 31, 2025--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test ...

The EVOLVITY 300 simplifies on-wafer probing with its compact, easy-to-use design, developed specifically for RF/DC modeling and device charact.

Wafer probing was courtesy of an old Electroglas EG4080 (pdf of latest 4090 linked) docked up to a Teradyne Catalyst. Quite a common configuration at that time.