The CoolSET SiP integrates a 950 V startup-cell, an 800 V avalanche rugged CoolMOS P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification (SR) controller, and ...

For a system working at sufficiently high speed a system designer ... Every time we make modifications in the PCB or package design it might be difficult to directly generate Z or Y parameters at high ...

The core problem inherent in routing 448G channels in PCBs is in the via transitions used in BGA escape routing, as well as ...

The chip saves space, cuts energy loss, removes the need for heat sinks, supports modern devices, reduces parts, and helps ...

Infineon Technologies has launched the CoolSET™ System in Package (SiP), a compact and integrated power controller designed to deliver efficien ...