A system in package, or SiP, is a way of bundling two or more ICs inside a single package. This is in contrast to a system on chip, or SoC, where the functions on those chips are integrated onto the ...

Driving Growth Through Miniaturization and 5G Propelling the System in Package (SiP) Die Market Rising demand for miniature, high-performance devices is fueling significant growth in the System in ...