A new technical paper titled “Advancing Trustworthiness in System-in-Package: A Novel Root ... chiplet hardware security module (CHSM), aiming to provide comprehensive and robust protection throughout ...

NT1021 is a single-chip dual-channel RF front-end consuming a very low power (47 ... RFIC can be delivered in three variants: 6x6mm QFN40 or 5x5mm QFN32 packages, or unpackaged, in dies for SiP ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...