A SiP's design can be influenced by the constraints of the package such as overall size and height, with the latter a common limiting factor for passive-component inclusion. The preferred way to begin ...

The mmWave block upconverter upconverts standard 2- to 18-GHz bands into mmWave signals (18 to 40 GHz) in a 30-mm 2 BGA ...

This has the benefit both of reducing the footprint occupied by the sensor and its associated components, and freeing the manufacturer of the need to develop and assemble a PCB. The SiP package ...

New features in Allegro 16.6 Package Designer and Cadence ® SiP Layout include open cavity support for die placement, a new wirebond application mode that improves efficiency, and a wafer-level ...

This paper will discuss the advantages of utilizing eWLB technology to create a SiP solution. We will review the design considerations for creating a double sided redistribution layer (RDL) on the ...

As the ICs and the major electrical component were packaged into a single module, this had increased the overall performance, reliability, and efficiency of the module. The System in Package (SiP ...