A SiP's design can be influenced by the constraints of the package such as overall size and height, with the latter a common limiting factor for passive-component inclusion. The preferred way to begin ...

This has the benefit both of reducing the footprint occupied by the sensor and its associated components, and freeing the manufacturer of the need to develop and assemble a PCB. The SiP package ...

New features in Allegro 16.6 Package Designer and Cadence ® SiP Layout include open cavity support for die placement, a new wirebond application mode that improves efficiency, and a wafer-level ...

This paper will discuss the advantages of utilizing eWLB technology to create a SiP solution. We will review the design considerations for creating a double sided redistribution layer (RDL) on the ...

is using Sequans chips as some of its solutions to manufacture Mobile WiMAX end user devices and SIP-based (system-in-package) modules. USI has been manufacturing WiMAX devices since 2004, and has ...

As the ICs and the major electrical component were packaged into a single module, this had increased the overall performance, reliability, and efficiency of the module. The System in Package (SiP ...

This series is designed to meet the greater current requirements found in many of todays’ applications and is provided in a 3-Pin micro miniature SIP package that is compatible ... need for any ...