in a single package. With this highly integrated solution, customers can create complete LIN nodes using just one IC. The new LIN SiP is based on Atmel's second-generation LIN IP with excellent ...

OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems San Jose, Calif., 04 May 2016 -- Cadence Design ...

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today announces it will showcase its nRF54L Series advanced multiprotocol Bluetooth LE Systems-on-Chip (SoCs), ...