The chip saves space, cuts energy loss, removes the need for heat sinks, supports modern devices, reduces parts, and helps ...

By performing early chip, package and system thermal analysis, designers can systematically predict the power profile of the chip for various scenarios and its impact on power-thermal reliability.

CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly efficient power delivery of up to 60 W at universal input voltage range of 85 – 305 V AC ...

This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.

Infineon Technologies AG launches its new CoolSET SiP, a compact, fully integrated system power controller for highly efficient power delivery of up to 60W at universal input voltage range of ...