“Flip-chip dominates the RF AiP mmWave market ... copper core ball wetting shows the routable Microleadframe at angle (b), and the package’s side view prior to molding (c). Source: Amkor Antenna in ...

Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers integration levels in a ...

Today, Freescale offers more than 280 LDMOS RF power devices in over-molded plastic packages, with output power as high as 120W at 2 GHz. Freescale was always confident that over-molded plastic ...

and over-mold them to enable unprecedented thermal performance,” said Mali Mahalingam, Freescale Fellow and head of RF package development. “In addition, this new package platform supports ...

We regard multichip module (MCM) BGA as an enabling technology that provides high-reliability, compact size, faster time to market and reduced costs for RF circuits ... film substrates sealed in a ...

For Remote Control Applications, New Devices Offer Increased Robustness to Optical and RF Emissions ... Minimold (TSOP93xxx), Mold (TSOP94xxx), or Minicast (TSOP98xxx) package.

but are RF transparent, or injection molded plastics, which are often less stiff and thus not relied on as a core structural element. Integrating Arris’s Additive Molding with the Skydio X2 The Skydio ...

Celanese has particularly formulated Hostaform RF to offer an easy-to-use, drop-in solution for traditional rotational molding. The rotational molding process manufactures parts by placing ...

AmpliTech Group, Inc's AMPG Spectrum Semiconductor Materials division collaborated with NGK Electronic Devices, a company in the semiconductor packaging industry, to become their U.S ...

Today, Freescale offers more than 280 LDMOS RF power devices in over-molded plastic packages, with output power as high as 120W at 2 GHz. Plastic packaging technology had been deployed in ...