ALBANY, New York, March 3, 2017 /PRNewswire/ --With Disco Corp. holding more than half of the global market for thin wafer processing and dicing e ...

SAN JOSE, Calif. – Corwil Technology Corp., a provider of contract assembly and wafer dicing services, today announced the acquisition of Disco Hi-Tec America's wafer thinning and polishing equipment ...

Intel has said it needs to be thriftier and approach production with a zero-waste model.; Execs said the company must prioritize efficiency over "no wafer left behind." Intel has lost ground to ...

Intel Corp. said it is on track to produce microprocessors on 450 mm silicon wafers after a major supplier, ASML, said it would stop developing the machines needed for the move to the larger ...

DISCO Corp. engages in the manufacturing and sale of precision cutting, grinding and polishing machines. It operates through the following business divisions: Precision Machines, Precision ...